AP Chemistry
4th Quarter--Week 2-- 2007-2008
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Tues |
4/22/08 |
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Collect: |
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Handout: |
Bonding Review, Electrochemistry
Review, Copper Plating Lab |
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Topics/Activity: |
Lab: Copper Plating |
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Homework: |
Complete
Electrochemistry Review, Bonding Review |
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Fri |
4/25/08 |
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Collect: |
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Handout: |
Review Ch 20, Nuclear
Reactions |
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Topics/Activity: |
Ch 21: Nuclear Reactions |
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Homework: |
Complete Handouts Prep for TEST on Tuesday over Ch 20-Electrochemistry |
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